你好,请登录   免费注册    |    收藏本站
联系电话: 0574-87917803
联系电话: call_new 0574-87917803
Candida glabrata (Anderson) Meyer et Yarrow
Candida glabrata (Anderson) Meyer et Yarrow
规格:
货期:
编号:TS181926
品牌:Testobio
产品名称: Candida glabrata (Anderson) Meyer et Yarrow
商品货号: TS181926
Deposited As: Torulopsis glabrata (Anderson) Lodder et de Vries, anamorph
Strain Designations: SA-3-7
Biosafety Level: 1

Biosafety classification is based on U.S. Public Health Service Guidelines, it is the responsibility of the customer to ensure that their facilities comply with biosafety regulations for their own country.

Product Format: freeze-dried
Type Strain: no
Preceptrol®: no
Comments:
Salt-tolerant, from pickling process of Narazuke
Medium: ATCC® Medium 200: YM agar or YM broth
Growth Conditions:
Temperature: 24.0°C
Sequenced Data:
Not available.
Name of Depositor: K Yamagata
Isolation:
Shimozuke mash, Japan
References:

Yamagata K, Fujita T. Characterization of salt-tolerant yeasts isolated from the pickling process of Narazuke. J. Ferment. Technol. 52: 217-224, 1974.

首页 > 产品中心 > 微生物培养 > 菌株 > null > Candida glabrata (Anderson) Meyer et Yarrow

Candida glabrata (Anderson) Meyer et Yarrow

  • 货号: TS181926
  • 好评
询价
  • 品牌 : TESTOBIO
产品名称: Candida glabrata (Anderson) Meyer et Yarrow
商品货号: TS181926
Deposited As: Torulopsis glabrata (Anderson) Lodder et de Vries, anamorph
Strain Designations: SA-3-7
Biosafety Level: 1

Biosafety classification is based on U.S. Public Health Service Guidelines, it is the responsibility of the customer to ensure that their facilities comply with biosafety regulations for their own country.

Product Format: freeze-dried
Type Strain: no
Preceptrol®: no
Comments:
Salt-tolerant, from pickling process of Narazuke
Medium: ATCC® Medium 200: YM agar or YM broth
Growth Conditions:
Temperature: 24.0°C
Sequenced Data:
Not available.
Name of Depositor: K Yamagata
Isolation:
Shimozuke mash, Japan
References:

Yamagata K, Fujita T. Characterization of salt-tolerant yeasts isolated from the pickling process of Narazuke. J. Ferment. Technol. 52: 217-224, 1974.

合作单位: